SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION

A silicone pressure-sensitive adhesive composition is disclosed. The composition can be cured into a pressure-sensitive adhesive having a good release force against a release liner and a high peel force against several substrates. The silicone pressure-sensitive adhesive composition comprises: (A) a...

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Bibliographische Detailangaben
Hauptverfasser:	JEON, Min-Cheol, KIM, Sun-Hee, CHOI, Ho-Jin
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A silicone pressure-sensitive adhesive composition is disclosed. The composition can be cured into a pressure-sensitive adhesive having a good release force against a release liner and a high peel force against several substrates. The silicone pressure-sensitive adhesive composition comprises: (A) a diorganopolysiloxane having on average at least 0.5 alkenyl groups with 2 to 12 carbon atoms per molecule; (B) an organopolysiloxane composed of R13SiO1/2 and SiO4/2 units, wherein each R1 represents a monovalent hydrocarbon group with 1 to 12 carbon atoms, having a molar ratio (R13SiO1/2 unit)/(SiO4/2 unit) of 0.6 to 1.7, and having a number average molecular weight (Mn) converted to standard polystyrene of from 1,700 to 3,000; (C) an organohydrogenpolysiloxane having on average at least two silicon-bonded hydrogen atoms per molecule; and (D) a hydrosilylation catalyst.