FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH CAPPING LAYER AND METHOD FOR FORMING THE SAME

A FinFET device structure is provided. The FinFET device structure includes a first gate structure formed over a fin structure, and a conductive layer formed over the first gate structure. The FinFET device structure includes a first capping layer formed over the conductive layer, and a top surface...

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Bibliographische Detailangaben
Hauptverfasser: WANG, Mei-Yun, CHEN, Chun-Han, LEE, Chen-Ming, YANG, Fu-Kai, LI, Jr-Hung, LU, Bo-Cyuan
Format: Patent
Sprache:eng
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Zusammenfassung:A FinFET device structure is provided. The FinFET device structure includes a first gate structure formed over a fin structure, and a conductive layer formed over the first gate structure. The FinFET device structure includes a first capping layer formed over the conductive layer, and a top surface of the conductive layer is in direct contact with a bottom surface of the first capping layer.