CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a sam...

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Bibliographische Detailangaben
Hauptverfasser: HUANG, Cheng-Lin, CHU, Che-Jung, LI, Ling-Wei, WU, Yu-Jui, CHEN, Lieh-Chuan, LI, Chien-Chen, YANG, Sheng-Yao, LIU, Kuo-Chio
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.