HEAT DISSIPATING ELEMENTS

Examples disclosed herein relate to heat dissipating elements of a computing device. The computing device including a chassis to house a heat generating element and a moveable member within the chassis in a closed state. The moveable member is to transition from the closed state to an open state. Th...

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Hauptverfasser:	WU, KUAN-TING, LIAO, CHENG-FENG, CHEN, WEIUNG
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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creator	WU, KUAN-TING LIAO, CHENG-FENG CHEN, WEIUNG
description	Examples disclosed herein relate to heat dissipating elements of a computing device. The computing device including a chassis to house a heat generating element and a moveable member within the chassis in a closed state. The moveable member is to transition from the closed state to an open state. The computing device further includes a heat dissipating element coupled to the moveable member to be exposed to an external environment in the open state. The heat dissipating element to be thermally coupled to the heat generating element in a closed state of the moveable member. The computing device also includes a motor to move the moveable member from the closed state to the open state in response to a temperature within the chassis exceeding a threshold.
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subjects	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
title	HEAT DISSIPATING ELEMENTS
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