HEAT DISSIPATING ELEMENTS

HEAT DISSIPATING ELEMENTS

Examples disclosed herein relate to heat dissipating elements of a computing device. The computing device including a chassis to house a heat generating element and a moveable member within the chassis in a closed state. The moveable member is to transition from the closed state to an open state. Th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WU, KUAN-TING, LIAO, CHENG-FENG, CHEN, WEIUNG
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Examples disclosed herein relate to heat dissipating elements of a computing device. The computing device including a chassis to house a heat generating element and a moveable member within the chassis in a closed state. The moveable member is to transition from the closed state to an open state. The computing device further includes a heat dissipating element coupled to the moveable member to be exposed to an external environment in the open state. The heat dissipating element to be thermally coupled to the heat generating element in a closed state of the moveable member. The computing device also includes a motor to move the moveable member from the closed state to the open state in response to a temperature within the chassis exceeding a threshold.