Method For Modeling and Analyzing Generalized Microscopic Stress Concentration Phenomenon on Machined Surface

A method is provided for modeling and analyzing a generalized microscopic stress concentration phenomenon on a machined surface. The modeling method includes: obtaining a true stress-strain curve of a matrix material structure of a specimen; obtaining a micro-topography curve of a machined surface o...

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Bibliographische Detailangaben
Hauptverfasser: LI, Xun, GUO, Zhiyuan, YANG, Shenliang
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method is provided for modeling and analyzing a generalized microscopic stress concentration phenomenon on a machined surface. The modeling method includes: obtaining a true stress-strain curve of a matrix material structure of a specimen; obtaining a micro-topography curve of a machined surface of a machined specimen; processing a plastic deformation layer of a surface of the machined specimen to obtain a plurality of sub-plastic deformation layers; according to the true stress-strain curve of the specimen and the plurality of sub-plastic deformation layers, obtaining a stress-strain curve of each sub-plastic deformation layer; according to the micro-topography curve of the machined surface, attribute information of the matrix material structure, the stress-strain curve of each sub-plastic deformation layer and a corresponding thickness of each sub-plastic deformation layer, constructing a two-dimensional layered finite element analysis model for analyzing the generalized microscopic stress concentration phenomenon of the machined surface of a specimen.