Package Structures and Methods of Forming the Same

Package Structures and Methods of Forming the Same

An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first comp...

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Hauptverfasser: Hou, Shang-Yun, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Lin, Jing-Cheng, Wu, Chi-Hsi, Hu, Hsien-Pin, Shih, Ying-Ching
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Hou, Shang-Yun
Yu, Chen-Hua
Lu, Szu-Wei
Wei, Wen-Hsin
Lin, Jing-Cheng
Wu, Chi-Hsi
Hu, Hsien-Pin
Shih, Ying-Ching
description An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020402877A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020402877A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020402877A13</originalsourceid><addsrcrecordid>eNrjZDAKSEzOTkxPVQguKSpNLiktSi1WSMxLUfBNLcnITylWyE9TcMsvys3MS1coyQCqSsxN5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGBiYGRhbm5o6GxsSpAgAyYSxS</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Package Structures and Methods of Forming the Same</title><source>esp@cenet</source><creator>Hou, Shang-Yun ; Yu, Chen-Hua ; Lu, Szu-Wei ; Wei, Wen-Hsin ; Lin, Jing-Cheng ; Wu, Chi-Hsi ; Hu, Hsien-Pin ; Shih, Ying-Ching</creator><creatorcontrib>Hou, Shang-Yun ; Yu, Chen-Hua ; Lu, Szu-Wei ; Wei, Wen-Hsin ; Lin, Jing-Cheng ; Wu, Chi-Hsi ; Hu, Hsien-Pin ; Shih, Ying-Ching</creatorcontrib><description>An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201224&amp;DB=EPODOC&amp;CC=US&amp;NR=2020402877A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201224&amp;DB=EPODOC&amp;CC=US&amp;NR=2020402877A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hou, Shang-Yun</creatorcontrib><creatorcontrib>Yu, Chen-Hua</creatorcontrib><creatorcontrib>Lu, Szu-Wei</creatorcontrib><creatorcontrib>Wei, Wen-Hsin</creatorcontrib><creatorcontrib>Lin, Jing-Cheng</creatorcontrib><creatorcontrib>Wu, Chi-Hsi</creatorcontrib><creatorcontrib>Hu, Hsien-Pin</creatorcontrib><creatorcontrib>Shih, Ying-Ching</creatorcontrib><title>Package Structures and Methods of Forming the Same</title><description>An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKSEzOTkxPVQguKSpNLiktSi1WSMxLUfBNLcnITylWyE9TcMsvys3MS1coyQCqSsxN5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGBiYGRhbm5o6GxsSpAgAyYSxS</recordid><startdate>20201224</startdate><enddate>20201224</enddate><creator>Hou, Shang-Yun</creator><creator>Yu, Chen-Hua</creator><creator>Lu, Szu-Wei</creator><creator>Wei, Wen-Hsin</creator><creator>Lin, Jing-Cheng</creator><creator>Wu, Chi-Hsi</creator><creator>Hu, Hsien-Pin</creator><creator>Shih, Ying-Ching</creator><scope>EVB</scope></search><sort><creationdate>20201224</creationdate><title>Package Structures and Methods of Forming the Same</title><author>Hou, Shang-Yun ; Yu, Chen-Hua ; Lu, Szu-Wei ; Wei, Wen-Hsin ; Lin, Jing-Cheng ; Wu, Chi-Hsi ; Hu, Hsien-Pin ; Shih, Ying-Ching</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020402877A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Hou, Shang-Yun</creatorcontrib><creatorcontrib>Yu, Chen-Hua</creatorcontrib><creatorcontrib>Lu, Szu-Wei</creatorcontrib><creatorcontrib>Wei, Wen-Hsin</creatorcontrib><creatorcontrib>Lin, Jing-Cheng</creatorcontrib><creatorcontrib>Wu, Chi-Hsi</creatorcontrib><creatorcontrib>Hu, Hsien-Pin</creatorcontrib><creatorcontrib>Shih, Ying-Ching</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hou, Shang-Yun</au><au>Yu, Chen-Hua</au><au>Lu, Szu-Wei</au><au>Wei, Wen-Hsin</au><au>Lin, Jing-Cheng</au><au>Wu, Chi-Hsi</au><au>Hu, Hsien-Pin</au><au>Shih, Ying-Ching</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package Structures and Methods of Forming the Same</title><date>2020-12-24</date><risdate>2020</risdate><abstract>An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Package Structures and Methods of Forming the Same
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