Package Structures and Methods of Forming the Same

Package Structures and Methods of Forming the Same

An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hou, Shang-Yun, Yu, Chen-Hua, Lu, Szu-Wei, Wei, Wen-Hsin, Lin, Jing-Cheng, Wu, Chi-Hsi, Hu, Hsien-Pin, Shih, Ying-Ching
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.