SURFACE PROTECTION COMPOSITION AND TERMINAL FITTED ELECTRIC WIRE

A surface protection composition having a compound represented by the formula (1) in an amount of 0.1 to 10 mass % in terms of phosphorus element with respect to the total amount of the composition, the compound (b) the metal-containing compound in an amount of 0.1 to 10 mass % in terms of a metal e...

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Bibliographische Detailangaben
Hauptverfasser:	HOSOKAWA, Takehiro, MIZOGUCHI, Makoto, OSHIUMI, Naoyuki
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRICITY FILLING PASTES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A surface protection composition having a compound represented by the formula (1) in an amount of 0.1 to 10 mass % in terms of phosphorus element with respect to the total amount of the composition, the compound (b) the metal-containing compound in an amount of 0.1 to 10 mass % in terms of a metal element with the total amount of the composition or the amine compound in an amount of 0.1 to 5.0 mass % in terms of nitrogen element the total amount of the composition, the compound (c) (meth)acrylate having 2 or more carbon-carbon double bonds and hydrocarbon chains having four or more carbon atoms in an amount of 1.0 to 70 mass % with the total amount of the composition, the compound (d) a photopolymerization initiator in an amount of 0.1 to 10 mass % with the total amount of the composition.