METHOD FOR MANUFACTURING A SPIRAL SPRING

Disclosed is a method including: a) obtaining a substrate extending in a predetermined plane with a first layer parallel to the plane; b) forming a through-hole in the first layer; c) depositing a second layer on the first, the second layer filling the a through-hole to form a bridge of material; d)...

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Bibliographische Detailangaben
Hauptverfasser:	KOHLER, Frédéric, BUCAILLE, Jean-Luc, DESPONT, Michel, HUNZIKER, Olivier
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING ORMAINTAINING CLOCKS OR WATCHES APPARATUS SPECIALLY ADAPTED THEREFOR APPARATUS THEREFOR CHEMISTRY CINEMATOGRAPHY CRYSTAL GROWTH ELECTROGRAPHY HOLOGRAPHY HOROLOGY MATERIALS THEREFOR MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL MECHANICALLY-DRIVEN CLOCKS OR WATCHES METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE REFINING BY ZONE-MELTING OF MATERIAL SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL
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Beschreibung
Zusammenfassung:	Disclosed is a method including: a) obtaining a substrate extending in a predetermined plane with a first layer parallel to the plane; b) forming a through-hole in the first layer; c) depositing a second layer on the first, the second layer filling the a through-hole to form a bridge of material; d) etching a hairspring in an etching layer made up of the second layer or the substrate, the one of the second layer and the substrate in which the a hairspring is not etched constituting a support, the bridge of material connecting the hairspring to the support perpendicular to the predetermined plane; e) removing the first layer, the hairspring remaining attached to the support by the bridge of material; f) subjecting the hairspring to a thermal treatment; and g) detaching the hairspring from the support.