Probe Card for Testing a Die to Be Installed in a Multichip-Module

An apparatus for testing an Integrated Circuit (IC) to be installed on a product substrate of a Multi-Chip Module (MCM) is disclosed. The apparatus includes a test substrate including (i) a first surface configured to receive the tested IC and at least an additional IC, (ii) a second surface that is opposite the first surface and is configured to receive electrical contacts, and (iii) first electrical traces for conveying electrical signals between the tested IC, the additional IC and the electrical contacts. The apparatus further includes a second electrical trace, which is formed in the test substrate instead of the additional IC and is configured to electrically connect between two of the first electrical traces.