SEMICONDUCTOR DEVICE

A semiconductor device includes a chip that includes a mounting surface, a non-mounting surface, and a side wall connecting the mounting surface and the non-mounting surface and has an eaves portion protruding further outward than the mounting surface at the side wall and a metal layer that covers t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAMURA, Masahiko, FUTAMURA, Yosui
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device includes a chip that includes a mounting surface, a non-mounting surface, and a side wall connecting the mounting surface and the non-mounting surface and has an eaves portion protruding further outward than the mounting surface at the side wall and a metal layer that covers the mounting surface.