POLISHING SOLUTION AND POLISHING METHOD

Provided is a method for polishing an article including a Co-containing portion to be polished by a polishing liquid, in which the polishing liquid contains water, abrasive particles, and a metal dissolving agent, a pH of the polishing liquid is 6.0 or more, and a content of hydrogen peroxide in the...

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Bibliographische Detailangaben
Hauptverfasser:	KONDO, Shunsuke, OTSUKA, Yuya, INOUE, Keisuke, OUCHI, Mayumi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a method for polishing an article including a Co-containing portion to be polished by a polishing liquid, in which the polishing liquid contains water, abrasive particles, and a metal dissolving agent, a pH of the polishing liquid is 6.0 or more, and a content of hydrogen peroxide in the polishing liquid is 0.0001% by mass or less based on the total mass of the polishing liquid.