APPARATUS USING HEAT PUMP

An apparatus using a heat pump includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit is allowed to perform a first operation, in which a load-side heat exchanger is used as a condenser, and a second operation, in which the load-side heat exchanger is used as an evaporator...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUZUKI, Yasuhiro, HATTORI, Taro, SUZUKI, Kazutaka, MINAMISAKO, Hirokazu, MITO, Takafumi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An apparatus using a heat pump includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit is allowed to perform a first operation, in which a load-side heat exchanger is used as a condenser, and a second operation, in which the load-side heat exchanger is used as an evaporator. A container is provided to a suction pipe provided between a refrigerant flow switching device and a compressor. To the heat medium circuit, an overpressure protection device and a refrigerant leakage detecting device are connected. When leakage of refrigerant into the heat medium circuit is detected, the refrigerant flow switching device is switched to a second state, an expansion device is set to a closed state, and the compressor is made in operation. When a requirement for ending the operation of the compressor is satisfied after the leakage of the refrigerant into the heat medium circuit is detected, the compressor is set to a stopped state, and the refrigerant flow switching device is switched to a first state.