RESIN COMPOSITION

The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKUDA, Ryoji, KIUCHI, Yohei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRICITY INDUCTANCES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MAGNETS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSFORMERS
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