RESIN COMPOSITION

The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OKUDA, Ryoji, KIUCHI, Yohei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRICITY INDUCTANCES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MAGNETS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSFORMERS
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern. In order to achieve the above-described purpose, the configuration of the present invention is as follows. A resin composition which contains (P) a resin that has an alicyclic structure and an aromatic ring structure, and wherein the resin (P) that has an alicyclic structure and an aromatic ring structure has a group having two or more alicyclic rings and a group wherein two or more benzene rings are bonded by means of a single bond.