METHOD AND SYSTEM FOR MANUFACTURING A SEMICONDUCTOR DEVICE

The present disclosure provides a method for manufacturing a semiconductor structure. The method includes receiving a layout data representing information for manufacturing the semiconductor structure having a metal layer over a substrate. A first parasitic capacitance and a second parasitic capacit...

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Bibliographische Detailangaben
Hauptverfasser: HUANG, HSUAN-MING, WANG, MING-YIH, CHANG, MINGNI, LU, YINLUNG, TENG, AN SHUN
Format: Patent
Sprache:eng
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