SEMICONDUCTOR DEVICE PACKAGE

An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side surface and the sixth side surface; a fifth corner area formed by the fifth side surface and the seventh side surface; and a sixth corner area formed by the sixth side surface and the seventh side surface, wherein the fifth corner area is disposed between the second corner area and the third corner area, and the sixth corner area is disposed between the third corner area and the fourth corner area.