COMPOSITION, FILM, AND PRODUCTION METHOD OF PATTERNED SUBSTRATE

The purpose of the present invention is to provide: a composition for forming a resist underlayer film, which is capable of forming a resist underlayer film that has excellent etching resistance, heat resistance, flatness and film defect suppressing properties; a resist underlayer film; a method for...

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Bibliographische Detailangaben
Hauptverfasser:	TANIGUCHI, Tomoaki, NAKAFUJI, Shin-ya, TAKANASHI, Kazunori, EHARA, Kengo
Format:	Patent
Sprache:	eng
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY ELECTROGRAPHY HETEROCYCLIC COMPOUNDS HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC CHEMISTRY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide: a composition for forming a resist underlayer film, which is capable of forming a resist underlayer film that has excellent etching resistance, heat resistance, flatness and film defect suppressing properties; a resist underlayer film; a method for forming a resist underlayer film; and a method for producing a patterned substrate. The present invention is a composition for forming a resist underlayer film, which contains a compound that has a group represented by one of formulae (1-1) to (1-3) and a solvent. In formulae (1-1) to (1-3), each of * and ** represents a site which is bonded to a moiety other than the group represented by one of formulae (1-1) to (1-3) in the compound; each of a and b independently represents an integer of 0-3; in cases where a is 0, b is 1 or more; and in cases where a is 1 or more, b is 0.