APPARATUS AND METHOD FOR DOUBLE-SIDE POLISHING WORK

Provided is a double-side polishing apparatus and a double-side polishing method which make it possible to terminate double-side polishing with timing allowing a work having been polished to have a target shape. A computing unit 13 performs a step of grouping the data of thicknesses measured using w...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KUBOTA, Mami, TAKANASHI, Keiichi
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a double-side polishing apparatus and a double-side polishing method which make it possible to terminate double-side polishing with timing allowing a work having been polished to have a target shape. A computing unit 13 performs a step of grouping the data of thicknesses measured using work thickness measuring devices 11 on a work basis; a step of extracting shape components of each work from the thickness data; a step of identifying a position of each of the shape components in the work radial direction; a step of computing a shape distribution of the work from the identified position ; a step of obtaining a shape index of the work from the computed shape distribution; and a step of determining timing of termination of the double-side polishing based on the obtained shape index, thus timing of termination of the double-side polishing is determined.