Leaded Semiconductor Package

A semiconductor package includes a mold compound, a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second (different) level outside the mold compound, and a semiconductor die embedded in the mold compound and attached to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Mohamad Tahir, Mohd Rasydan Hakam, Pavaluta, Ciprian Mircea, Lee, Swee Kah, Muhammat Sanusi, Muhammad, Kim, Do Hyung, Othman, Nurfarena
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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