Leaded Semiconductor Package

A semiconductor package includes a mold compound, a plurality of electrically conductive leads at least some of which transition from a first level within the mold compound to a second (different) level outside the mold compound, and a semiconductor die embedded in the mold compound and attached to the plurality of electrically conductive leads in a flip-chip configuration. One or more leads of the plurality of electrically conductive leads includes a first section terminating at a side face of the mold compound or protruding from the side face with a first end positioned outside a footprint of the mold compound and which terminates at the second level, and a second section embedded in the mold compound and having a second end which is positioned under the semiconductor die and exposed at a bottom side of the semiconductor package. Corresponding methods of manufacture are also described.