ELECTRONIC COMPONENT COOLING MODULE AND ELECTRONIC APPARATUS

An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, towa...

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Bibliographische Detailangaben
1. Verfasser:	KANAI, Yuki
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, and a height maintaining portion that maintains a dimension in a height direction, and a supporter configured to support the tube, and a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.