REINFORCED THERMOPLASTIC MOULDING COMPOSITION

Polyamide moulding composition consisting of the following components(A) 28.0-64.9 wt % of at least one polyamide,(B) 15.0-40.0 wt % of glass fibres,(C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 pi II,(D) 0.1-2.0 wt % of heat stabilizer,(E) 0-5.0 wt % of addi...

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Bibliographische Detailangaben
1. Verfasser:	AEPLI, Etienne
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:	Polyamide moulding composition consisting of the following components(A) 28.0-64.9 wt % of at least one polyamide,(B) 15.0-40.0 wt % of glass fibres,(C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 pi II,(D) 0.1-2.0 wt % of heat stabilizer,(E) 0-5.0 wt % of additiveswith the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.