CURABLE FILM-FORMING COMPOSITIONS CONTAINING RHEOLOGY MODIFIERS COMPRISING NON-AQUEOUS DISPERSIONS

A curable film-forming composition is provided, comprising: (a) a polymeric binder comprising epoxy functional groups; (b) a curing agent comprising acid functional groups that are reactive with the epoxy functional groups of (a); (c) a non-aqueous dispersion comprising a dispersion polymerization r...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CAO, BIN, LUCHANSKY, MATTHEW S, WANG, WEI, SIMPSON, DENNIS ALLAN, HUI, CHIN MING, GONZALEZ, INANLLELY YUDERKA, FENN, DAVID ROBERT
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A curable film-forming composition is provided, comprising: (a) a polymeric binder comprising epoxy functional groups; (b) a curing agent comprising acid functional groups that are reactive with the epoxy functional groups of (a); (c) a non-aqueous dispersion comprising a dispersion polymerization reaction product of a reaction mixture comprising an ethylenically unsaturated monomer and a nonlinear, random, acrylic polymer stabilizer; and (d) fumed silica. The dispersion polymerization reaction product in the non-aqueous dispersion (c) is present in the curable film-forming composition in an amount of 0.5 to 10 percent by weight, and the fumed silica (d) is present in an amount of 0.5 to 5 percent by weight, based on the total weight of resin solids in the curable film-forming composition. Also provided are multi-layer coated articles that include the curable film-forming compositions described above.