METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically, the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a fol...

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Bibliographische Detailangaben
Hauptverfasser:	UCHIMURA, Ryoichi, TOSAKA, Yuji, NAKAMURA, Yukio, SASAKI, Ryohta, SAITOH, Takeshi, SHIMIZU, Hiroshi
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically, the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a following formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material. 0.12 < a 1 + a 2 / 2 / B 0.8 ¤ a 1 / a 2 ¤ 1.25