HIGH POWER LED ASSEMBLY AND METHOD OF FORMING A HIGH POWER LED ASSEMBLY

HIGH POWER LED ASSEMBLY AND METHOD OF FORMING A HIGH POWER LED ASSEMBLY

Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength conversion layer, and an optically transparent sidewall surrounding the LED die, the optically transparent si...

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Hauptverfasser: Go, Tyan-Shin, Yong, Cheng Loong, Daeschner, Walter, Tan, Aik-Teng, Goetz, Werner, Lim, Chong Tat
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Go, Tyan-Shin
Yong, Cheng Loong
Daeschner, Walter
Tan, Aik-Teng
Goetz, Werner
Lim, Chong Tat
description Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength conversion layer, and an optically transparent sidewall surrounding the LED die, the optically transparent sidewall having a curved or angled profile, attaching the LED sub-assembly to the lead frame, and dispensing an encapsulation material in a space surrounding the LED sub-assembly attached to the lead frame. The LED assembly is a high power LED assembly.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HIGH POWER LED ASSEMBLY AND METHOD OF FORMING A HIGH POWER LED ASSEMBLY
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