HIGH POWER LED ASSEMBLY AND METHOD OF FORMING A HIGH POWER LED ASSEMBLY

Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength conversion layer, and an optically transparent sidewall surrounding the LED die, the optically transparent si...

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Bibliographische Detailangaben
Hauptverfasser:	Go, Tyan-Shin, Yong, Cheng Loong, Daeschner, Walter, Tan, Aik-Teng, Goetz, Werner, Lim, Chong Tat
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Systems, apparatus and methods of forming an LED device are described herein. The method includes providing a lead frame and an LED sub-assembly including an LED die attached to a wavelength conversion layer, and an optically transparent sidewall surrounding the LED die, the optically transparent sidewall having a curved or angled profile, attaching the LED sub-assembly to the lead frame, and dispensing an encapsulation material in a space surrounding the LED sub-assembly attached to the lead frame. The LED assembly is a high power LED assembly.