SELECTIVE DIELECTRIC DEPOSITION

Methods, apparatuses, and systems related to selectively depositing a liner material on a sidewall of an opening are described. An example method includes forming a liner material on a dielectric material of sidewalls of an opening and a bottom surface of an opening and removing the first liner mate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Borsari, Silvia, Khandekar, Anish, Heineck, Lars P, Xie, Zhiqiang
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Methods, apparatuses, and systems related to selectively depositing a liner material on a sidewall of an opening are described. An example method includes forming a liner material on a dielectric material of sidewalls of an opening and a bottom surface of an opening and removing the first liner material of the sidewalls of the opening and the bottom surface of the opening using a non-selective etch chemistry. The example method further includes forming a second liner material on the dielectric material of the sidewalls of the opening to avoid contact with the bottom surface of the opening.