Substrate Transporting Method and Substrate Processing System

Provided is a substrate transferring method which is capable of accurately mounting a substrate at a desired rotation angle. In order to eliminate a misalignment of a wafer W in a rotational direction in a vacuum process chamber, which is caused by a variation in a transfer distance of the wafer W,...

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Bibliographische Detailangaben
1. Verfasser:	KONDOH, Keisuke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MANIPULATORS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a substrate transferring method which is capable of accurately mounting a substrate at a desired rotation angle. In order to eliminate a misalignment of a wafer W in a rotational direction in a vacuum process chamber, which is caused by a variation in a transfer distance of the wafer W, the wafer W is mounted on a stage while being offset from the center of the stage in a load lock chamber and an angle of rotation of the wafer W with respect to a fork when a transfer arm receives the wafer W is changed.