COPPER ALLOY

A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 10≤[Zn]−0.3×[Sn]−2×[Ni]≤28, 10≤f3=...

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Bibliographische Detailangaben
Hauptverfasser: Hata, Katsuhiko, Oishi, Keiichiro, Nakasato, Yosuke, Tanaka, Shinji
Format: Patent
Sprache:eng
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Zusammenfassung:A copper alloy according to the present invention includes 17 mass % to 34 mass % of Zn, 0.02 mass % to 2.0 mass % of Sn, 1.5 mass % to 5 mass % of Ni, and a balance consisting of Cu and unavoidable impurities, in which relationships of 12≤f1=[Zn]+5×[Sn]−2×[Ni]≤30, 10≤[Zn]−0.3×[Sn]−2×[Ni]≤28, 10≤f3={f1×(32−f1)×[Ni]}1/2≤33, 1.20≤0.7×[Ni]+[Sn]≤4, and 1.4≤[Ni]/[Sn]≤90 are satisfied, conductivity is 13% IACS to 25% IACS, a ratio of an α phase is 99.5% or more by area ratio or an area ratio of a γ phase (γ)% and an area ratio of a β phase (β)% in an α phase matrix satisfy a relationship of 0≤2×(γ)+(β)≤0.7.