MONITORING OF POLISHING PAD TEXTURE IN CHEMICAL MECHANICAL POLISHING

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to press an abrasive body against the polishing surface, an in-situ polishing pad monit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Cherian, Benjamin, Osterheld, Thomas H
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICS POLISHING TRANSPORTING
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