MONITORING OF POLISHING PAD TEXTURE IN CHEMICAL MECHANICAL POLISHING

An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to press an abrasive body against the polishing surface, an in-situ polishing pad monit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Cherian, Benjamin, Osterheld, Thomas H
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to press an abrasive body against the polishing surface, an in-situ polishing pad monitoring system including an imager disposed above the platen to capture an image of the polishing pad, and a controller configured to receive the image from the monitoring system and generate a measure of polishing pad surface roughness based on the image. The controller can use machine-learning based image processing to generate the measure of surface roughness.