POLISHING DEVICE AND POLISHING METHOD

A polishing device includes a substrate holder, a dispenser configured to dispense an abrasive to a surface of a substrate held by the substrate holder, a polisher including an elastic body configured to polish the surface of the substrate as the elastic body is rotated with respect to the surface o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	GAWASE, Akifumi
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	A polishing device includes a substrate holder, a dispenser configured to dispense an abrasive to a surface of a substrate held by the substrate holder, a polisher including an elastic body configured to polish the surface of the substrate as the elastic body is rotated with respect to the surface of the substrate. An area of contact between the elastic body and the surface of the substrate during polishing is smaller than a surface area of a region of the substrate that is to be polished by the elastic body. The elastic body is moved, while the elastic body is rotated, with a downward velocity component prior to contacting the surface of the substrate and with an upward velocity component after the elastic body comes into contact with the surface of the substrate.