DOUBLE INDUCTOR INTEGRATED POWER MODULE FOR HIGH CURRENT APPLICATIONS

The disclosed technology relates to a power supply circuit that utilizes an integrated power module that has a first and second power converter disposed on opposite sides of an inductor core. The power supply circuit includes an inductor core comprising a plurality of nano-magnetic layers embedded within a printed circuit board, a first winding disposed on a first outer surface of the inductor core, a second winding disposed on a second outer surface of the inductor core, a first active layer disposed on an outer surface of the first winding, a second active layer disposed on an outer surface of the second winding, a first capacitor tile disposed on an outer surface of the first active layer, and a second capacitor tile disposed on an outer surface of the second active layer.