PACKAGE ON PACKAGE AND PACKAGE CONNECTION SYSTEM COMPRISING THE SAME

PACKAGE ON PACKAGE AND PACKAGE CONNECTION SYSTEM COMPRISING THE SAME

A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE, Young Kwan, HUR, Young Sik, YOON, Ho Kwon, LEE, Yun Tae, SO, Won Wook
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package-on-package includes a first semiconductor package including a first semiconductor chip and a second semiconductor package, disposed on the first semiconductor package, including a second semiconductor chip electrically connected to the first semiconductor chip. Each of the first and second semiconductor chips includes one or more units. The number of units of the first semiconductor chip is greater than the number of units of the second semiconductor chip. The one or more units of the first semiconductor chip and the one or more units of the second semiconductor chip implement a function of an application processor chip.