Lead Frame Stabilizer for Improved Lead Planarity

A packaged semiconductor device includes a die paddle, a semiconductor die mounted on the die paddle, a plurality of fused leads extending away from a first side of the die paddle, a discrete lead that extends away from the first side of the die paddle and is physically detached from the plurality of fused leads, a first electrical connection between a first terminal of the semiconductor die and the discrete lead, an encapsulation material that encapsulates the semiconductor die, and a stabilizer bar connected to a first outer edge side of the discrete lead. The first outer edge side of the discrete lead is opposite from a second outer edge side of the discrete lead which faces the plurality of fused leads.