ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING
The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconduct...
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| creator | WU, Yiliang BECKER, Tobias GULSOY, Gokce WOLF, Marco SANATI, Shahrokh BAYES, Martin W |
| description | The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2020294684A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2020294684A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2020294684A13</originalsourceid><addsrcrecordid>eNrjZHB09fNw9HN2dVEIcA1y8w_yBXEUQn1Cghyd_f1cQp1DPMNcFZz9A4DSCo5-QGVB_s6uwcEK_m4Kvo7enn7uPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPjTYyAAILU3MLEwcDY2JUwUAjEUr8Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING</title><source>esp@cenet</source><creator>WU, Yiliang ; BECKER, Tobias ; GULSOY, Gokce ; WOLF, Marco ; SANATI, Shahrokh ; BAYES, Martin W</creator><creatorcontrib>WU, Yiliang ; BECKER, Tobias ; GULSOY, Gokce ; WOLF, Marco ; SANATI, Shahrokh ; BAYES, Martin W</creatorcontrib><description>The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200917&DB=EPODOC&CC=US&NR=2020294684A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200917&DB=EPODOC&CC=US&NR=2020294684A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU, Yiliang</creatorcontrib><creatorcontrib>BECKER, Tobias</creatorcontrib><creatorcontrib>GULSOY, Gokce</creatorcontrib><creatorcontrib>WOLF, Marco</creatorcontrib><creatorcontrib>SANATI, Shahrokh</creatorcontrib><creatorcontrib>BAYES, Martin W</creatorcontrib><title>ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING</title><description>The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB09fNw9HN2dVEIcA1y8w_yBXEUQn1Cghyd_f1cQp1DPMNcFZz9A4DSCo5-QGVB_s6uwcEK_m4Kvo7enn7uPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPjTYyAAILU3MLEwcDY2JUwUAjEUr8Q</recordid><startdate>20200917</startdate><enddate>20200917</enddate><creator>WU, Yiliang</creator><creator>BECKER, Tobias</creator><creator>GULSOY, Gokce</creator><creator>WOLF, Marco</creator><creator>SANATI, Shahrokh</creator><creator>BAYES, Martin W</creator><scope>EVB</scope></search><sort><creationdate>20200917</creationdate><title>ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING</title><author>WU, Yiliang ; BECKER, Tobias ; GULSOY, Gokce ; WOLF, Marco ; SANATI, Shahrokh ; BAYES, Martin W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2020294684A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WU, Yiliang</creatorcontrib><creatorcontrib>BECKER, Tobias</creatorcontrib><creatorcontrib>GULSOY, Gokce</creatorcontrib><creatorcontrib>WOLF, Marco</creatorcontrib><creatorcontrib>SANATI, Shahrokh</creatorcontrib><creatorcontrib>BAYES, Martin W</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU, Yiliang</au><au>BECKER, Tobias</au><au>GULSOY, Gokce</au><au>WOLF, Marco</au><au>SANATI, Shahrokh</au><au>BAYES, Martin W</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING</title><date>2020-09-17</date><risdate>2020</risdate><abstract>The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING |
| title | ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING |
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