ENHANCED PERFORMANCE ULTRACONDUCTIVE COPPER AND PROCESS OF MAKING

The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconduct...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WU, Yiliang, BECKER, Tobias, GULSOY, Gokce, WOLF, Marco, SANATI, Shahrokh, BAYES, Martin W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure.