PHOTOSENSITIVE ADHESIVE

The present invention provides a photosensitive adhesive comprising a composition of 0.1 portion to 1 portion by weight of photo initiator; 0.1 portion to 3 portions by weight of organic silicone; 10 portions to 32.5 portions by weight of isocyanate; 10 portions to 32.5 portions by weight of hydroxy...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	MAK, Wei Kong Wilson
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides a photosensitive adhesive comprising a composition of 0.1 portion to 1 portion by weight of photo initiator; 0.1 portion to 3 portions by weight of organic silicone; 10 portions to 32.5 portions by weight of isocyanate; 10 portions to 32.5 portions by weight of hydroxyethyl terminated polysiloxane; 10 portions to 32.5 portions by weight of polycarbonate diol; 5 portions to 17.5 portions by weight of hydroxyethyl acrylate; 0.01 portion to 0.5 portion by weight of catalyst; and 0.01 portion to 0.5 portion by weight of polymerization inhibitor.