PRESSURE-SENSITIVE ADHESIVE

Pressure-sensitive adhesives, adhesive tapes, and methods enable high bond strengths on non-polar or rough substrates. The pressure-sensitive adhesives and methods comprise (a) at least one poly(meth)acrylate, (b) at least one resin A selected from colophony resins and terpene-phenolic resins, (c) a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	PÜTZ, Benjamin, ZIMMERMANN, Sarah
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Pressure-sensitive adhesives, adhesive tapes, and methods enable high bond strengths on non-polar or rough substrates. The pressure-sensitive adhesives and methods comprise (a) at least one poly(meth)acrylate, (b) at least one resin A selected from colophony resins and terpene-phenolic resins, (c) at least one hydrocarbon resin B1 having a softening point of greater than 50° C., and (d) at least one hydrocarbon resin B2 having a softening point of less than or equal to 25° C. The adhesive tapes comprise one or more layers of the pressure-sensitive adhesives, and the methods may produce adhesive bonds on substrates with low surface energy and/or on substrates with a mean roughness of at least 5 μm.