METHODS FOR LINEAR LASER PROCESSING OF TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS

A method for processing a transparent workpiece includes forming a closed contour in the transparent workpiece. The closed contour includes a plurality of defects in the transparent workpiece and has a rectilinear shape. Forming the closed contour includes directing a pulsed laser beam through an as...

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Bibliographische Detailangaben
Hauptverfasser: Webb, Michael Brian, Levi, Roni Daniel
Format: Patent
Sprache:eng
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Zusammenfassung:A method for processing a transparent workpiece includes forming a closed contour in the transparent workpiece. The closed contour includes a plurality of defects in the transparent workpiece and has a rectilinear shape. Forming the closed contour includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece to generate an induced absorption within the transparent workpiece and produce a defect within the transparent workpiece. Forming the closed contour also includes translating the pulsed laser beam focal line along a closed contour line having the rectilinear shape, thereby laser forming the plurality of defects of the closed contour. In addition, the method for processing the transparent workpiece includes etching the transparent workpiece with a chemical etching solution to separate a portion of the transparent workpiece along the closed contour, thereby forming an aperture extending through the transparent workpiece.