SYSTEMS FOR APPLYING ELECTRICALLY CONDUCTIVE TAPE TRACES TO A SUBSTRATE AND METHODS OF USE THEREOF

A system for forming a conductive tape trace on a substrate includes a segment feeder arm configured to feed segments of conductive tape to the substrate and a segment placement armature configured to grasp and position the conductive tape segments in a predetermined pattern on the substrate. The conductive tape segments include a plurality of conductive tape bend segments and at least one conductive tape branch segment. The segment placement armature is configured to position and overlap the plurality of conductive tape bend segments on the substrate to form a conductive tape bend and position the at least one conductive tape branch segment in contact with and extending from the conductive tape bend. A roller can be included and be configured to apply a force onto the conductive tape segments positioned on the substrate. A welder that welds the conductive tape segments together can also be included.