MULTI-CAVITY PACKAGE FOR ULTRASONIC TRANSDUCER ACOUSTIC MODE CONTROL

A micromechanical system (MEMS) device package comprising a substrate and a first enclosure including a first cavity, coupled to the substrate. Wherein a transverse dimension of the first cavity relative to the substrate is configured to reduce undesirable acoustic modes within the first cavity and...

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Bibliographische Detailangaben
Hauptverfasser:	Goericke, Fabian, Shelton, Stefon
Format:	Patent
Sprache:	eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PUBLIC ADDRESS SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	A micromechanical system (MEMS) device package comprising a substrate and a first enclosure including a first cavity, coupled to the substrate. Wherein a transverse dimension of the first cavity relative to the substrate is configured to reduce undesirable acoustic modes within the first cavity and the first cavity comprises an acoustic port. A MEMS device is located inside the first cavity and an Application Specific Integrated Circuit (ASIC) is communicatively coupled to the MEMS device and located outside the first cavity.