HOT MELT COMPOSITION, HOT MELT COMPOSITION PRODUCTION METHOD, SEAL MATERIAL, ELECTRONIC DEVICE, AND LAMP

One aspect of the present invention is a hot melt composition including a modified thermoplastic polymer having an alkoxysilyl group in a molecule; a softener; and a catalyst.

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Bibliographische Detailangaben
Hauptverfasser:	KUROKAWA, Hiroshi, FUKUDA, Katsuhito
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR USE OF MATERIALS AS ADHESIVES WEAPONS
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Beschreibung
Zusammenfassung:	One aspect of the present invention is a hot melt composition including a modified thermoplastic polymer having an alkoxysilyl group in a molecule; a softener; and a catalyst.