ETCHING SOLUTION FOR SILICON SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Disclosed is an etching solution for a silicon substrate. More specifically, an etching solution for a silicon substrate is disclosed in which a concentration of a silane compound (silicon) in the etching solution for the silicon substrate is adjusted to improve an etching selectivity of a silicon n...

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Bibliographische Detailangaben
Hauptverfasser: JANG, Pyong-Hwa, YOO, Ho-Seong, KIM, Myung-Hyun, LEE, Jun-Eun
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed is an etching solution for a silicon substrate. More specifically, an etching solution for a silicon substrate is disclosed in which a concentration of a silane compound (silicon) in the etching solution for the silicon substrate is adjusted to improve an etching selectivity of a silicon nitride film relative to a silicon oxide film during etching of the nitride film.