ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Ke, Chun-Chi, Tsai, Wen-Jung, Chiu, Chih-Hsien, Tsai, Ying-Chou, Yeh, Mao-Hua
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.