PHOTORESIST DISPENSING MODULE AND PHOTORESIST COATING SYSTEM HAVING THE SAME

The present disclosure provides a photoresist dispensing module for dispensing a photoresist solution onto a wafer. The photoresist dispensing module includes a first nozzle, a second nozzle, and a photoresist pipeline assembly coupled to the first nozzle and the second nozzle. The first nozzle is c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM, JAE-SIK, JANG, SUNGKUN, LIM, JONG-KILL
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure provides a photoresist dispensing module for dispensing a photoresist solution onto a wafer. The photoresist dispensing module includes a first nozzle, a second nozzle, and a photoresist pipeline assembly coupled to the first nozzle and the second nozzle. The first nozzle is configured to dispense the photoresist solution to a first portion of the wafer. The second nozzle is configured to dispense the photoresist solution to a second portion of the wafer. The photoresist pipeline assembly is configured to supply the photoresist solution to the first nozzle and the second nozzle.