METAL PASTE AND THERMOELECTRIC MODULE

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which ad...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Park, Cheol-Hee, Kim, Dong-Sik, Lee, Dae Ki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.