ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD USING THE SAME

An electroplating apparatus includes a plating bath and a substrate in a horizontal direction. The electroplating apparatus further includes a plurality of cathodes on first and second sides of the substrate in a first direction on one surface of the substrate, and an anode above the substrate, the...

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Hauptverfasser:	Kim, WooChan, Choi, Changjun, Kim, Gotae, Kim, Wook, Moon, SangCheol
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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